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Technology Trend
  • UDSM (Ultra Deep Sub Micron)
    - Less Wire Width
    - Increase Wire Thickness
    - Less Wire Space
    - Increase Coupling CAP (Crosstalk)
  • Frequency
    - Higher Frequency
    - Higher Signal Switching
  • SOC(System On Chip) With Big Analog and Big Digital
    - Analog와 Digital이 혼합된 SOC형태의 Design Demand
    - Analog와 Digital의 혼합으로 인해 더욱 많은 Noise 발생
 
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